Laser Applications

Micro Materials Processing

JPS TBC’s Manchester, NH laser applications and micro processing facility provides customers with the highest quality laser micromachining contract manufacturing and process development services. Our lab focuses on high brightness and high precision applications across a wide range of wavelengths from 193nm – 1064nm.

We understand laser-material interaction and work with our customers to develop laser micro processes that focus on providing high throughput and quality with an affordable cost per part.

Our state-of-the-art laser systems can process a variety of difficult to machine materials including, Alumina/ceramic, Glass, Polymers (and most organic materials), Silicon, dDiamond, FR4, MgO, Sapphire, and many more.


JP Sercel TBC will work with you to provide:

  • Features at 2µm or less
  • Blind holes and micro vias, with sub-micron depth control
  • Better than 1um hole-to-hole repeatability
  • Aspect ratios greater than 10:1
  • Quick turnaround
  • Material processing capabilities in plastics, polymers, ceramics, glass, sapphire, metals, diamond

Typical applications include:

  • Micro-hole drilling with little to no taper angles, and high aspect ratios
  • Laser Lift-Off of UV and Micro LEDs
  • Laser Scribing LEDs
  • Precision hole drilling for probe cards
  • Annealing
  • Parylene ablation from metal pads or pins
  • Apertures, orifices
  • Micro-arrays and micro-grids for chemical and biological analysis
  • Biosensors (lab-on-a-chip)
  • Physical sensors: accelerometers, strain and pressure gauges
  • MEMS, micro machines
  • Catheter drug delivery flow orifices
  • Stent machining
  • Skiving
  • Ink-jet nozzles
  • Micro machining, drilling, scribing and dicing for sapphire, fused silica, CVD diamond
  • Micro via drilling
  • Selective ablation of coatings, photo ablation, photo machining
  • Micro filters